Navigation

  • English

Prof. Dr.-Ing. Klaus Helmreich

  • Organisation: Department Elektrotechnik-Elektronik-Informationstechnik (EEI)
  • Abteilung: Professur für Rechnergestützten Schaltungsentwurf (Prof. Dr. Helmreich)
  • Telefonnummer: +49 9131 85-20740
  • E-Mail: klaus.helmreich@fau.de
  • Adresse:
    Cauerstr. 9
    91058 Erlangen
    Raum 05.232

Positionen und Funktionen

Vita

Klaus Helmreich received the Diploma degree in physics focused on test and failure analysis of integrated circuits and Dr. Eng. degree from Friedrich-Alexander University Erlangen-Nu ̈rnberg (FAU), Erlangen, Germany, in 1993. He was with industry as a Technology Specialist, where he was involved in mixed-signal test, device interfacing, and signal integrity characterization. Since 2004, he has been a Professor with the Institute of Microwaves and Photonics, FAU. His current research interests include signal integrity, material characterization, and test

Neueste Veröffentlichungen

  • K. Lomakin, R. Guschlbauer, F. Osmanlic, Z. Fu, M. Sippel, K. Helmreich, C. Körner, M. Vossiek and G. Gold, "3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band", in Proceedings of the EuMW 2019, Paris, Oktober, 2019.
  • F. Distler, M. Sippel, J. Schür, G. Gold, K. Helmreich and M. Vossiek, "Additively Manufactured Dielectric Waveguides for Advanced Concepts for Millimeter-Wave Interconnects", IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 11, pp. 4298-4307, September, 2019.
  • K. Lomakin, L. Klein, L. Ringel, J. Ringel, M. Sippel, K. Helmreich and G. Gold, "3D Printed E-Band Hybrid Coupler", IEEE Microwave and Wireless Components Letters, vol. 29, no. 9, pp. 580-582, September, 2019.
  • I. Lau, A. Hajian, F. Michler, G. Gold, F. Lurz, U. Schmid, K. Helmreich, R. Weigel and A. Kölpin, "Influence of the PCB Manufacturing Process on the Measurement Error of Planar Relative Permittivity Sensors Up To 100 GHz", IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 7, pp. 2793-2804, Juli, 2019.
  • K. Lomakin, S. Herold, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "3D Printed Slotted Rectangular Hollow Waveguides", in Proceedings of the IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019., Boston USA, Juni, 2019.
  • G. Gold, K. Lomakin, K. Helmreich and U. Arz, "High-Frequency Modeling of Coplanar Waveguides Including Surface Roughness", Advances in Radio Science, no. 17, April, 2019.
  • K. Lomakin, S. Herold, L. Ringel, J. Ringel, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019.
  • K. Lomakin, M. Ankenbrand, M. Sippel, J. Franke, K. Helmreich and G. Gold, "Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz", in Proceedings of the 1st IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019), Glasgow, 2019.
  • K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, T. Weidner, K. Helmreich, M. Ankenbrand and J. Franke, "3D Printed Helix Antenna", in Proceedings of the European Conference on Antennas and Propagation (EUCAP), London, GB, 2018.
  • K. Lomakin, D. Simon, M. Sippel, G. Gold, K. Helmreich, E. Seler, Z. Tong and R. Reuter, "3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band", in Proceedings of the 48th European Microwave Conference (EuMW 2018), 2018.
  • K. Lomakin, G. Gold and K. Helmreich, "Analytical Waveguide Model Precisely Predicting Loss and Delay Including Surface Roughness", IEEE Transactions on Microwave Theory and Techniques, 2018.
  • M. Ankenbrand, J. Franke, K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, T. Weidner, D. Weiß and K. Helmreich, "Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren", PLUS - Produktion von Leiterplatten und Systemen, 2018.
  • K. Lomakin et al., "Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material", IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 1-1, 2018.
  • M. Ankenbrand, M. Scheetz, J. Franke, K. Lomakin, M. Sippel, G. Gold and K. Helmreich, "Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies", in Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID), 2018.
  • K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, K. Helmreich, M. Ankenbrand, N. Urban and A. Franke, "Impact of Surface Roughness on 3D printed SLS Horn Antennas", in Proceedings of the European Conference on Antennas and Propagation (EUCAP), 2018.
  • K. Lomakin, M. Sippel, G. Gold, J. Fröhlich, K. Helmreich, M. Ankenbrand and J. Franke, "Low reflective aerosol Jet printed broadband matched load up to 67 GHz", in Proceedings of the German Microwave Conference, 2018.
  • M. Köppel, M. Deckelmann, M. Sippel, K. Lomakin, S. Werzinger, G. Gold, K. Helmreich and B. Schmauß, "Using coherent optical frequency domain reflectometry to assist the additive manufacturing process of structures for radio frequency applications", in Proceedings of the SPIE Optics + Photonics: Optical Engineering + Applications, San Diego, US, 2018.
  • K. Lomakin, M. Sippel, G. Gold, J. Ringel, D. Weiß, K. Helmreich, M. Ankenbrand and J. Franke, "Substituting bond wires by additively manufactured interconnections", in Proceedings of the German Microwave Conference, 2018.
  • G. Gold and K. Helmreich, "Modeling Conductor Surface Roughness", in Proceedings of the IMS 2017 Workshop on New Developments in Microwave Measurements for Planar Circuits and Components, Honolulu, US, 2017.
  • K. Lomakin, G. Gold and K. Helmreich, "Transmission Line Model for Rectangular Waveguides accurately incorporating Loss Effects", in Proceedings of the 21st IEEE Workshop on Signal and Power Integrity (SPI 2017), Baveno, IT, 2017.
  • K. Lomakin, M. Sippel, G. Gold, P. Rochholz, K. Helmreich, M. Ankenbrand, D. Gräf and J. Franke, "Additive Fertigung in der Hochfrequenztechnik – Potenziale und Herausforderungen", PLUS - Produktion von Leiterplatten und Systemen, 2017.
  • G. Gold and K. Helmreich, "A Physical Surface Roughness Model and Its Applications", IEEE Transactions on Microwave Theory and Techniques, 2017.
  • M. Sippel, K. Lomakin, G. Gold, T. Reitberger, S. Neermann and K. Helmreich, "Simple Approach for brief RF Characterization of thin 3D printable Dielectrics", in Proceedings of the 21st IEEE Workshop on Signal and Power Integrity (SPI 2017), Baveno, IT, 2017.
  • M. Sippel, K. Lomakin, G. Gold and K. Helmreich, "Characteristics of Anisotropic Conducting Polymers Suggest Feasibility of Test Fixtures up to 110 GHz", Electronics, 2017.
  • G. Gold and K. Helmreich, "Modeling of Transmission Lines with Multiple Coated Conductors", in Proceedings of the 46th European Microwave Week, London, Oktober, 2016.
  • M. Sippel, G. Gold and K. Helmreich, "Signal propagation properties of anisotropic conducting polymers up to 110 GHz and their applicability in test fixtures", in Proceedings of the 20th IEEE Workshop on Signal and Power Integrity, SPI 2016, 2016.
  • K. Helmreich and G. Gold, "Erzeugung von 3D-Funktionsstrukturen für Hochfrequenzanwendungen durch Druckverfahren", PLUS - Produktion von Leiterplatten und Systemen, no. 12, pp. 2417-2419, 2016.
  • G. Gold and K. Helmreich, "Measuring Design-DK and True Permittivity of PCB Materials up to 20 GHz", in Proceedings of the Proceedings of the 9th German Microwave Conference (GeMiC2015), pp. 154-157, Nuremberg, Germany, 2015.
  • G. Gold and K. Helmreich, "Surface Impedance Concept for Modeling Conductor Roughness", in Proceedings of the Proceedings of the IEEE MTT-S International Microwave Symposium 2015 (IMS 2015), pp. 1-4, Phoenix, Arizona, USA, 2015.
  • G. Gold and K. Helmreich, "Effective Conductivity Concept for Modelling Conductor Surface Roughness", in Proceedings of the Proceedings, Santa Clara (CA), USA, 2014.
  • G. Gold and K. Helmreich, "PCB Design up to 67 GHz (W32) - PCBs for Microwave Applications up to 40 GHz and Beyond: Material Characterization, Surface Roughness Consideration, Modeling and Design Perspectives", in Proceedings of the 43th European Microwave Week, Nuremberg, Germany, 2013.
  • G. Gold and K. Helmreich, "PCBs for Microwave Applications up to 40 GHz and Beyond: Material Characterization, Surface Roughness Consideration, Modeling and Design Perspectives", in Proceedings of the Workshop Proceedings W32: PCB Design up to 67 GHz, pp. W32-2, Nürnberg, 2013.
  • G. Gold and K. Helmreich, "Measuring Dielectric Properties of PCB Material in the Two-Digit GHz-Range", in Proceedings of the Abstract Book, pp. 34-36, Chemnitz, 2013.
  • G. Gold and K. Helmreich, "A physical model for skin effect in rough surfaces", in Proceedings of the 42th European Microwave Week, Amsterdam, November, 2012.
  • K. Helmreich, "Measuring Signal Integrity", IEEE Microwave Magazine, vol. 12, no. 5, pp. 75-82, August, 2011.
  • D. Glaser, A. Müller, P. Lu, G. Uygur and K. Helmreich, "Standardized Characterisation of Device Power Supplies for Automated Test Generation and Simulation", in Proceedings of the Tagungsband, pp. 85-90, Erfurt, 2010.
  • G. Uygur, P. Lu, D. Glaser, S. Weichselgartner, K. Helmreich, S. Sattler, A. Lechner and A. Brenneke, "Optimales, skalierbares Ressourcenmanagement für modulare, gemischt analog-digitale Testsysteme", in Proceedings of the Tagungsband, pp. 119-126, Stuttgart, 2009.
  • P. Lu, D. Glaser, S. Weichslgartner, G. Uygur, K. Helmreich and A. Lechner, "Bridge the Gap between Simulation and Test: An OSA-Compliant Virtual Test Environment", in Proceedings of the Proceedings, pp. 214-219, Anaheim, California, 2009.
  • P. Lu, D. Glaser, G. Uygur and K. Helmreich, "A Novel Approach to Entirely Integrate Virtual Test into Test Development Flow", in Proceedings of the Proceedings, pp. 797-802, Nice, France, 2009.
  • P. Lu, D. Glaser, G. Uygur and K. Helmreich, "The Best of Both Worlds: Merging the Benefits of Rack&Stack and Universal ATE", in Proceedings of the Conference Proceedings, pp. L 3.2, Austin, Texas, 2009.
  • P. Lu, D. Glaser, G. Uygur, S. Weichselgartner, K. Helmreich and A. Lechner, "Mixed-Signal Test Development using Open Standard Modeling and Description Languages", in Proceedings of the Proceedings, pp. 78-83, San Jose, California, 2009.
  • D. Glaser, P. Lu and K. Helmreich, "Vollständige Integration des virtuellen Tests in den Entwurfsprozess integrierter Schaltungen", in Proceedings of the Tagungsband, pp. 67-72, Bremen, 2009.
  • K. Helmreich and G. Uygur, "Automatischer Abgleich von Leistungskopplern", in Proceedings of the Tagungsband, pp. 25-32, Ingolstadt, 2008.
  • K. Helmreich, "Signal Integrity: From Signal Path Analysis to Application Performance Prediction", in Proceedings of the Tutorial TMB Demystifying Microwave Signal Integrity - High Speed Design & Measurement, pp. 1-85, Atlanta, 2008.
  • P. Lu and K. Helmreich, "Standards-Based Construction of a Virtual Test Environment", in Proceedings of the Tagungsband, pp. 19-23, Wien, 2008.
  • K. Helmreich, "A Multiple Domain Characterisation and Test Method for Discontinous Signal Paths", in Proceedings of the Proceedings, pp. 139-142, Berlin, 2006.
  • K. Helmreich, "Präzise Prüfung von Leitungswellenwiderstand und Signalintegrität an Leiterplatten", in Proceedings of the Kostengünstige Entwicklung und Fertigung komplexer Leiterplatten, pp. Testen und Fertigen, München, 2006.